SIP Designs
InstonTech's SiCAPs provide compact from factors with a thin profile and small dimensions that enable high-density integration into advanced System-in-Package (SIP) designs. Good heat dissipation is also crucial for these densely packaged chips.
InstonTech's SiCAPs provide compact from factors with a thin profile and small dimensions that enable high-density integration into advanced System-in-Package (SIP) designs. Good heat dissipation is also crucial for these densely packaged chips.
Core Advantages:
Compact Form Factor: Enables high density integration in space-constrained SIP designs.
Superior Heat Dissipation: Ensures efficient thermal management, enhancing reliability in SIP designs.
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