▍ Product Overview
Instontech leverages 8/12-inch CMOS back-end processes to manufacture high-performance silicon capacitors. Using advanced PVD and CVD techniques, we deposit the capacitor's internal electrode and dielectric layers with precision. These processes result in a denser, more uniform dielectric layer, as well as improved contact formation, significantly enhancing the capacitor's reliability. Our strict process control ensures exceptional consistency, making our capacitors highly consistent and reliable.
In addition to reliability, Instontech’s silicon capacitors offer outstanding performance characteristics, including exceptional voltage stability (<0.001%/V) and temperature stability (<50ppm/K). We currently offer three series of silicon capacitor products tailored for diverse applications: the HQ, VE, and HC series.
High-Q (HQ) series: The HQ series is designed specifically for RF applications, offering superior performance and tolerance over MLCCs. Key features include:
Ultra-low tolerance:Tolerance as small as 0.02pF – 2x improvement to MLCCs
Lower ESL and Higher SRF: Self Resonant frequency about twice of MLCCs for the same capacitance.
High Q factors.
Compact Packaging: Package size as small as 008004 and thickness of 150um (<100um available), ideal for space-constraint designs like mobile applications.
Superior heat dissipation for greater workloads
Vertical Electrode (VE) series: The VE series features vertical electrode capacitors designed to replace traditional single-layer ceramic capacitors (SLCs) in optical communication, millimeter-wave communication, and similar fields. Key highlights include:
Exceptional Thermal/Voltage Stability using first-class ceramic materials.
High Capacitance Accuracy achieved through improved processes.
Beveled Edge Design:Reduces air breakdown risk and enhances visual clarity.
Enhanced Mounting Durability: Thicker electrode layers (200 µm) minimize short circuit risks caused by conductive adhesive overflow.
Custom Capacitor Array Options: Customed Capacitor Arrays provide exceptional flexibility and saves board space for multi-channel designs. Tapeouts are available Bi-annually or on-demand at an additional cost.
HC (High Capacitance) Series: The HC series utilize an improved deep trench capacitor technology to achieve ultra-high capacitance density. This technology is currently under development and expected to be available Q3 2025.
▍ Key Features